Enabling Global Electronics Through Material Innovation

WEM-140B

Standard-Tg laminate with low moisture absorption for general-purpose PCB applications.

Tg: 140°C

Td: 310°C

Z-axis exp. 50–260°C: 4%

Moisture Absorption: <0.2%

Peel Strength: >10 lb/in

Mid-Tg laminate with controlled Z-axis expansion and reliable thermal performance.

Tg: >155°C

Td: 340°C

Z-axis exp. 50–260°C: 2.50%

Moisture Absorption: <0.2%

Peel Strength: >10 lb/in

High-Tg laminate with controlled Z-axis expansion and enhanced thermal performance.

Tg: >175°C

Td: 340°C

Z-axis exp. 50–260°C: 2.40%

Moisture Absorption: <0.2%

Peel Strength: >10 lb/in

Very-high-Tg laminate with ultra-low Z-axis expansion and exceptional thermal reliability.

Tg: 220°C

Td: 350°C

Z-axis exp. 50–260°C: <1.3%

Moisture Absorption: <0.2%

Peel Strength: >7 lb/in

Halogen-free very-high-Tg laminate with superior thermal decomposition performance and ultra-low Z-axis expansion for high-reliability applications.

Tg: 220°C

Td: 390°C

Z-axis exp. 50–260°C: <1.5%

Moisture Absorption: <0.2%

Peel Strength: >7 lb/in